How telcos and OEMs can simplify IoT with a single chip-to-cloud partner

At MWC25, Mobile World Live caught up with Trasna CEO Stéphane Fund to explore how a fully integrated chip-to-cloud approach is helping telcos and OEMs reduce complexity, improve security, and accelerate time to market in the fast-moving IoT space.
Overcoming IoT’s biggest challenges
For many operators and device manufacturers, IoT rollouts are slowed by a fragmented supply chain. It’s common to work with five or more vendors – one for SIMs, another for connectivity, and more for device management and security.
However, this multi-vendor approach often leads to integration headaches, hidden costs, and inconsistent market performance.
Why a unified approach from chip to cloud works best
In the interview, Fund explains how bringing together the key IoT building blocks – from semiconductor design and eSIM provisioning to secure connectivity and cloud-based device management – can dramatically simplify operations for telcos and OEMs alike.
“If you’re a device manufacturer, you don’t need to find five or six suppliers – You get one fully integrated solution that’s ready to go.”
The benefits for telcos and OEMs
For network operators and original equipment manufacturers, thisintegrated model means:
- Faster go-to-market – no delays from vendor integration oronboarding
- End-to-end security – built in at every stage from chip to cloudvia SIM, device and apps
- Total supply chain control – from chip design and eSIMmanufacturing to backend orchestration
- Scalability – easily expandacross new markets or devices without reinventing the stack
Simplifying remote management at scale
One highlight of Trasna’s MWC25 showcase was its cloud-based unified SIM and device management platform — offering unparalleled end-to-end security and simplified for operations. For telcos, this provides a way to manage thousands (or millions) of connected devices remotely with automation, multi-tenancy, and real-time visibility.
Supporting 5G IoT with next-gen chipsets
With the rise of 5G – especially narrowband and private network deployments – telcos and OEMs need hardware optimised for low power, high performance, and secure connectivity. Trasna is now developing chipsets specifically built for this, enabling smarter, more efficient device rollouts.
Watch the full Mobile World Live interview below to learn how a unified chip-to-cloud strategy is helping telcos and OEMs future-proof their IoT business.
Details
The landscape of smart cities, utilities, security systems, and device manufacturing is rapidly evolving.